Testing Setup:

CPU: Intel Q6600

• Motherboard: Gigabyte Motherboard
• Ram: 2x 1 GB Kingston
• OS: Windows XP Home SP3
• Video Card: ATI Redeon 2400 HD
• Power Supply: 500 W PSU
• Ambient Temp: 21º C

Testing:

I will be testing the four thermal compounds under the same conditions. The room temp will remain constant 21º C through out the tests. During the tests I will be watching the temp of my CPU while my computer is sitting idle and also under load while using Prime95.

Note: After re-running the tests for a longer period of time these are the temps we where able to pull.

While being different from anything I had used in the past, the Coollaboratory LIQUID MetalPad proved to be quite a good product. Being, bar none, the easiest thermal compound I have ever used. All there was to do was to take it out of its sleeve, put it on the CPU, and replace the heat sink. The total time of installation was 30 seconds if that. Removing the heat sink and the old paste took longer than applying the Coollaboratory LIQUID MetalPad. When all was said and done, the Coollaboratory LIQUID MetalPad was by far the fastest thermal compound I had ever used. There was almost no clean up afterward, with no worry about getting it on my fingers and then on every thing I touched after that. Now let’s wrap this up and get to my final thoughts: